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Wafer Level Packaging and Bonding. Ready to solve your most challenging projects. Introducing the Palomar 6532HP 1. 5 micron die bonding placement accuracy for the optoelectronics market. Exceeding standards, the 6532HP is exceptionally accurate, the newest high-precision, high-performance, high-production die bonder in the world. Fully automated, high capacity feeders maximize your production and ROI. The 9000 Wedge Bonder .
SCI Automation Pte Ltd
Enrico Malatesta
210, Tuas South Avenue 2 West Point BizHub
Singapore, Singapore, 637210
sg
Netsarius LLP
H K Loo
10 Anson Road #24-09 International Plaza Singapore 079903
Singapore, Singapore, 079903
sg
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